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Glue Dispensing Machine

Our Glue Dispensing Machine provides precise and automated adhesive application for manufacturing and assembly processes. Engineered to deliver consistent dispense control and accurate placement, this solution improves product quality, reduces material waste, and enhances production efficiency across diverse industrial applications.

Where Our Technologies Perform

Specifications

  • Machine Type

    Automatic or semi-automatic glue dispensing machine configurable as per application.

  • Dispensing Material

    Supports adhesives, sealants, resins, epoxies, and other viscous materials.

  • Dispensing Accuracy

    High-precision dispensing control for consistent bead and dot application.

  • Dispensing Pattern

    Programmable bead, dot, line, and custom dispensing patterns.

  • Flow Rate Control

    Precise control of material flow using servo or pneumatic systems.

  • Control System

    PLC-based control with HMI touch screen for easy operation and recipe selection.

  • Nozzle & Valve System

    Interchangeable dispensing valves and nozzles for different material viscosities.

  • Data Monitoring

    Real-time monitoring of dispensing parameters and cycle data logging.

  • Safety Features

    Emergency stop, safety interlocks, and enclosed dispensing area.

  • System Integration

    Compatible with conveyors, robots, vision systems, and automated assembly lines.

Where Our Technologies Perform

Benefits

  • Delivers consistent and accurate adhesive application every cycle
  • Reduces material waste with controlled dispensing
  • Improves product strength and bond reliability
  • Minimizes manual labor and operator fatigue
  • Integrates seamlessly with upstream and downstream automation
  • Supports diverse fluids and dispense patterns

Acrobot Technologies

Why Choose Glue Dispensing Machine?

Our Glue Dispensing Machine delivers high-precision adhesive automation tailored to your production needs. Combining intelligent dispense control, flexible programming, and seamless system integration, this solution ensures consistent bond quality, efficient material usage, and enhanced throughput. Ideal for electronics, automotive, consumer products, and industrial assembly applications, it helps you reduce defects, optimize processes, and improve overall efficiency.

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